Double Side
D/S, the copper sheets are bonded to the top and bottom of the PI films. Since the land, which is the welded part, can be formed at the top and bottom on this structure, the density of the components can be improved when compared to other structures of the same size.

Application - LCD and TFT-LCD Fusion - Mobile Phone Keypad, Side Key - Higher density circuits than S/S - Mounting components to FPC

Double Access Dobule Access Type products, the copper sheets are raw materials without the PI films. While these products are similar to D/S because the upper and lower sides of Coverlay are bonded, the top side of one copper sheet is bonded to the Coverlay and so the pattern is formed. Then, the bottom side is bonded to the Coverlay.  Application - Folder Type Mobile Phone

Multilayer As the home appliances and communication devices become more compact and have higher functionality, the products tend to be multi-layered for mounting more circuits and components on the same sized product.

Application - Color, Folder Type Mobile Phone - High Density Circuit

Rigid Flexible This circuit is a compound product that has ability to make easy to SMT work with both merits of hardness of Rigid and softness of Flexible and a technical capability of Flexible.

Application - Mobile Phone Keypad - CDRW Pick up Ass'y - Built-in Type